Sino Corrugated logo
April 8-10, 2025
Shanghai New International Expo Centre, Shanghai, China


WEPACK 2025
Japan Press Conference Held Successfully,
Expanding a Legion of High-quality
East Asian Buyers to Visit on Site!

Group photo from the event site

"SinoCorrugated 2025 Press Conference", held at RX Tokyo Office on October 24, has successfully concluded. The event invited 30+ industry representatives, including leading Japanese corrugated board enterprises, advanced technology and equipment manufacturers, corrugated board-related associations and media, to RX's Japanese office to share industry information and jointly discuss future market directions and opportunities.

As attending guests actively engaged in exchanges and interactions, many Japanese industry peers expressed optimism about the Japanese packaging market for 2025-2026. With high expectations for SinoCorrugated scheduled to be held on April 8 at the Shanghai New International Expo Center, they look forward to more comprehensively examining the Chinese packaging market on site and plan to invest in cost-effective equipment suitable for future applications in the Japanese packaging market. The event was successfully held in the specialized and pleasant atmosphere of RX's Japanese office!

RX's Japanese office

At SinoCorrugated 2025 Press Conference, World Packaging Organisation Vice President Nerida Kelton emphasized the global impact of European packaging regulations and discussed sustainable packaging design principles. She proposed strategies for achieving circular packaging economy, including waste-free design, unified standard, ensuring recyclability, reducing original material use, and avoiding problematic materials, with an aim of protecting the environment and preventing packaging materials from polluting the Earth.

Following that were opening remarks from representative of RX China. Then, multiple representative enterprises delivered keynote speeches: BHS's keynote speech on "Solution sharing for corrugated board production lines"; SDK Crownway shared intelligent logistics solutions on site; SPT KingTau Machinery shared digital printing solutions; KBM Kenhua delivered a speech themed on "onsite upgrading and renovation in the Japanese market to provide better whole-plant cleaning systems"...

World Packaging Organisation
Vice President Mrs. Nerida Kelton

Mr. Adward Lu,
Senior Project Manager of RX

Mr. Yu Ishida
(CEO, BHS Corrugated Singapore PTE LTD)

Mr. Li Wenchen, Deputy General Manager of Guangdong
Crownway Intelligent Technology Co., Ltd.

Naohiro Tomita, Manager at SEIKO (SII Co., Ltd.),
also gave a speech for Guangzhou KingTau Machinery

Mr. Ruan Zijian, General Manager of Dongguan Jiam-
ing Environmental Protection Equipment Co., LTD

At the event, RF Systems Co., Ltd. Coordinator Hiroshi Uemura gave a speech on "Intelligent Evolution of Chinese Corrugated Board Plants". After introducing his professional background, Mr. Uemura analyzed China's current social state and highlighted challenges facing Chinese corrugated board plants, including labor shortages and accelerating automation.

Regarding intelligence, he referred to the digitization and automation management implemented by Chinese plants to meet international client requirements, and also introduced the latest production management systems like Zhikongbao and Dongfang Digicom systems, as well as Chinese tech enterprises' innovation capability such as the application of digital printing machines and AGV. Mr. Uemura concluded with his vision for China's corrugated board, including intelligent plant development trends and international market expansion.

In his speech, Mr. Makoto Takaura from Daio Paper Corporation introduced the company's founding in 1943 and its 671 billion yen sales in 2023. The company's product range spans paper, paperboard, household and personal care products, packaging, and functional paper, etc. For Japanese market, paperboard export destinations are seeing a shift from Japan to ASEAN countries, particularly Vietnam and the Philippines, alongside Chinese enterprises' expansion into these markets.

Daio Paper's JPK represents the first paperboard in the Asian market that meet the Asian market standards. Their JPK-SSS (high rupture paperboard) has grown from 40% to 60% market share since its 2020 launch. With its superior folding endurance and compression strength, JPK-SSS has emerged as an alternative to KLB or high rupture grades, with ongoing exploration into broader basis weight ranges for new opportunities.

Following the speeches at WEPACK 2025 Press Conference, the Organizer arranged a visit to a local Japanese carton plant for the attendees.

Highlight Recap

We sincerely thank all industry peers for your support and participation, and look forward to an larger Japanese delegation comprising more enterprises at WEPACK 2025 (World Expo of Packaging Industry) (April 8-10, 2025, Shanghai New International Expo Center), for deeper and more comprehensive reference exchanges and research to foster technical exchanges and collaboration